原文中的敘述
The highly-efficient 32GB RDIMM consists of 36 dual-die 40nm-class 4Gb DDR3 chips that can perform at equal or greater levels to a 40nm-based 16GB RDIMM with no increase in power consumption.
堆疊封裝應是正確的,為了增加記憶體密度的做法之一,但亦不限定只有2個晶粒,可以更多,達到更大的容量表現