技嘉 推出 新版 模組化水冷「3D Galaxy II」

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消息來源：ASCII

SPEC

「3D Galaxy」的後繼型號 「3D Galaxy II」120mm 風扇搭載

對應CPU：LGA775/Socket 939/AM2 並支援技嘉自家機殼 「3D Aurora 570」

本體模組化整套水冷日幣定價約： 21,980
模組化顯示卡水冷頭日幣定價約： 5,980

商品情報圖片：

http://akiba.ascii24.com/akiba/news/2006/09/21/imageview/images819853.jpg.html
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